Dow Water & Process Solutions offers specially-designed ion exchange resins providing a long service time and high capacity for polishing high purity water for specialty electronics applications, such as the manufacturing of display devices, lower density integrated circuit (IC) chips and back-end chip dicing and mounting operations.

Related Products

Product Description Type Matrix Total Exchange Capacity eq/l (kgr/ft3) Available Forms
AMBERJET™ UP1400 Uniform particle size, gel type cation exchange resin developed specifically for use in producing ultrapure water for the semiconductor industry. Strong Acid Cation Styrene divinylbenzene copolymer ≥ 2.00 H+
AMBERJET UP4000 Uniform particle size, gel type anion exchange resin developed specifically for use in producing ultra-pure water for the semiconductor industry. Strong Base Anion Polystyrene divinylbenzene copolymer ≥ 1.10 OH-
AMBERJET UP6040 Semi-conductor grade mixed bed resin specifically designed for use in non regenerable final polishing units in the highest purity water treatment applications. ≥ 2.00 / ≥ 1.10 H+ / OH-
AMBERJET UP6150 Fully regenerated mixed bed of cation and anion exchange resins intended for use in high purity water systems after reverse osmosis. ≥ 1.80 / ≥ 1.00 H+ / OH-
AMBERLITE™ IRA958CL Industrial grade anion exchange resin that is useful as as organic scavenger. Strong Base Anion Crosslinked acrylic macroreticular structure ≥ 0.80 Cl-