Ultrapure water specifications and analytical measurement capabilities have advanced to meet the exacting needs of microprocessor, semiconductor and other silicon based device manufacturers.

DOW™ FILMTEC™ SG30-400/34i reverse osmosis elements have been developed to meet the requirements of higher overall rejection, higher rejection of lower molecular weight organic compounds and silica and an accelerated TOC rinse down profile. These high surface area elements allow for system design with fewer elements and a lower applied operating pressure, thus optimizing amortization of capital costs while lowering operating cost.

SG30-400/34i comes with iLEC™ interlocking endcaps that reduce system operating costs, reduce the risk of o-ring leaks and the generation of small particles that lead to poor water quality, and eliminate the need for lubricants. See Form No. 609-00446 (120KB PDF) for more information on the benefits of iLEC interlocking endcaps.

SG30-400/34i is intended primarily for polishing use in traditional UPW systems designed for higher pressure operation. It features a 34 mil spacer to lessen the impact of fouling and pressure drop across a vessel, increasing running time between cleaning and enhancing cleaning effectiveness.

 

Nominal Active Surface Area
ft2 (m2)
Permeate Flow Rate
gpd (m3/d)
Stabilized Salt Rejection
(%) 
400 (37) 10,200 (38.6) 99.5 
  1. Pure water flow based on the following conditions: 225 psi (1.55 MPa), 77°F (25°C) and 15% recovery.
  2. Flow rates for individual elements may vary, but will be no more than 15% below the value shown.
  3. Product specifications may vary slightly as improvements are implemented.
  4. Typical stabilized salt rejection (Cl-) for individual element is 99.5% under the test conditions of 2,000 ppm NaCl, 225 psi (1.55 MPa), 77°F (25°C), pH 8 and 15% recovery. At lower TDS (<5 ppm), ion rejections are decreased depending on ionic strength, pH and ionic species.

Literature

Literature & Manuals


Technical Documents
Product Datasheet (PDF)
English (88KB)